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Build Summary 1

9,999.00 EGP
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Description

Build Summary 1

 

 

AMD Ryzen 3 4300G 4C 8T 3.8 4.0GHz Boost 6MB 45-65W AM4 Box with Radeon Graphics 100-100000144BOX

 

  • 4 Cores & 8 Threads, 6 MB Cache

  • Base Clock: 3.8 GHz, Max Boost Clock: up to 4.0 GHz

  • Memory Support: DDR4 3200MHz, Memory Channels: 2, TDP: 65W, PCI Express Generation : PCIe Gen 3

  • Compatible with Motherboards based on 500 Series Chipset, Socket AM54

  • On Chip Graphic Card , Included Heatsink Fan: Wraith Stealth

Description

Series: AMD Ryzen 3 (4-core)

Model: Ryzen 3 4300G

Technology: 7 nm

Frequency: 3.80 GHz

Cache: 4 MB

Cores: 4

Threads: 8

Instruction set: 64-bit

Supported RAM: DDR4

Number of memory channels: 2

Technologies: PCI Express 3.0 interface

Built-in video: AMD Radeon Graphics

Consumption: 65 W

Socket: AM4

 

Specifications

CHARACTERISTICS

 

Cache memory 4096

Socket AM4

Processor frequency (MHz) 3800

Turbo Boost up to 4 GHz

Data width (bits) 64

Number of cores 4

Processor technology (nanometers) 7

Thermal power (W) 65W

Others PCI Express 3.0 interface

 

MSI A520M-A PRO DDR4 AM4 Micro ATX Motherboard

Brand

MSI

Model

A520M-A PRO

SOCKET

AMD Socket AM4

CHIPSET

AMD A520 Chipset

MEMORY CHANNEL

Dual

DIMM SLOTS

2

MAX MEMORY (GB)

64

PCI-E X16

1

PCI-E GEN

Gen3

PCI-E X1

1

SATAIII

4

M.2 SLOT

1

USB 3.2 PORTS (FRONT)

2(Gen 1, Type A)

USB 3.2 PORTS (REAR)

4(Gen 1, Type A)

USB 2.0 PORTS (FRONT)

4

USB 2.0 PORTS (REAR)

2(Type A)

SERIAL PORTS(FRONT)

1

AUDIO PORTS (REAR)

Realtek ALC892/ALC897 Codec

DVI-D

1

HDMI

1

DIRECTX

12

OPERATING SYSTEM

Support for Windows 10 64-bit

FORM FACTOR

MATX

CPU

Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update

Memory

2x DDR4 memory slots, support up to 64GB

Slots

1x PCIe 3.0 x16 slot, 2x PCIe 3.0 x1 slot

Storage

1x M.2 slot, 6x SATA 6Gbps ports

USB Port

6x USB 3.2 Gen 1, 6x USB 2.0

Audio

8-Channel(7.1) HD Audio with Audio Boost

LAN

Realtek 8111H Gigabit LAN controller
 

DAHUA SSD-C800AS 2.5" SATA Solid State Drive

 

> Adopts high-quality wafer level chip
> Supports SATA 3.0 protocol with transmission speed up to 550 MB/s
> View information through S.M.A.R.T
> Provides better read and write performance with TRIM and NCQ
> Low power consumption management

Product Model

DHI-SSD-C800AS120G

DHI-SSD-C800AS240G

DHI-SSD-C800AS480G

DHI-SSD-C800AS500G

Capacity1

120 GB

240 GB

480 GB

500 GB

Form Factor

2.5 inch

Port

SATA III 6Gb/s

Net Weight

Max 40 g (0.09 lb)

Product Dimensions

100.20 mm × 69.90 mm × 7.00 mm (3.94" × 2.75" × 0.28")

Packaging Dimensions

140.50 mm × 105.50 mm × 15.50 mm (5.53" × 4.15" × 0.61")

Memory Component

3D NAND

Power Consumption

1195 mW (max)
415 mW (idle)

1200 mW (max)
370 mW (idle)

1600 mW (max)
510 mW (idle)

1910 mW (max)
790 mW (idle)

S.M.A.R.T

Support

TRIM

Support

Garbage Collection

Support

Sequential Read2

Up to 500 MB/s

Up to 500 MB/s

Up to 530 MB/s

Up to 530 MB/s

Sequential Write2

Up to 400 MB/s

Up to 450 MB/s

Up to 470 MB/s

Up to 500 MB/s

MTBF

1,500,000 hours

Operating Temperature

0°C to +70°C (+32°F to +158°F)

Storage Temperature

–40°C to +85°C (–40°F to +185°F)

Operating Humidity

5%–95% (non-condensing)

Vibration Resistance

10-200Hz, 0.5G

TBW

Up to 50 TB

Up to 100 TB

Up to 150 TB

Up to 200 TB

Reference
Information

1. Capacity calculation: 1GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage).
2. System configuration of performance test: Intel Z390 Chipset, Intel Core i9-9900KF@3.6GHz, 16GB DDR4; operating system-Windows 10 x64; testing tool-CrystalDiskMark 6.0.0.
3. Warranty period or maximum write amount (TBW), whichever comes first.
4. High performance SLC cache has been enabled.

(*Above data based on internal testing of Dahua Memory Laboratory)

 

Product Model

DHI-SSD-

C800AS960G

DHI-SSD-C800AS1000G

DHI-SSD-C800AS2000G

Capacity1

960 GB

1000 GB

2000 GB

Form Factor

2.5 inch

Port

SATA III 6Gb/s

Net Weight

Max 40 g (0.09 lb)

Product Dimensions

100.20 mm × 69.90 mm × 7.00 mm (3.94" × 2.75" × 0.28")

Packaging Dimensions

140.50 mm × 105.50 mm × 15.50 mm (5.53" × 4.15" × 0.61")

Memory Component

3D NAND

Power Consumption

2200 mW (max)
550 mW (idle)

1960 mW (max)
840 mW (idle)

2500 mW (max)
960 mW (idle)

S.M.A.R.T

Support

TRIM

Support

Garbage Collection

Support

Sequential Read2

Up to 550 MB/s

Up to 550 MB/s

Up to 550 MB/s

Sequential Write2

Up to 490 MB/s

Up to 500 MB/s

Up to 460 MB/s

MTBF

1,500,000 hours

Operating Temperature

0°C to +70°C (+32°F to +158°F)

Storage Temperature

–40°C to +85°C (–40°F to +185°F)

Operating Humidity

5%–95% (non-condensing)

Vibration Resistance

10-200 Hz, 0.5G

TBW

Up to 310 TB

Up to 400 TB

Up to 800 TB

Reference
Information

1. Capacity calculation: 1GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage).
2. System configuration of performance test: Intel Z390 Chipset, Intel Core i9-9900KF@3.6GHz, 16GB DDR4; operating system-Windows 10 x64; testing tool-Crystal DiskMark 6.0.0.
3. Warranty period or maximum write amount (TBW), whichever comes first.
4. High performance SLC cache has been enabled.

(*Above data based on internal testing of Dahua Memory Laboratory)

 


ARKTEK AK-33-Black Case 3xFans Prism ARGB + PSU 600W EU

AK-33 Black Micro ATX case
Left Glass side panel
Supports 240mm Water Cooling
Graphics card length 305mm
CPU Fan height 160mm
Dimension (LxWxH) 315*185*420mm

1. Standard ATX power supply/down power supply
2. The rear panel can accommodate 1*12CM fan/the power compartment can accommodate 2*12CM fan
3. Hardware architecture: 0.45SPCC fully baked paint/left glass side panel
4. Expansion PCI port * 4
5. Can install MicroATX/MiniATX motherboard
6. Graphics card length 305MM
7. CPU height 160MM
8. Hard drive 3.5 * 1+2.5 * 2
9. USB 1.0 * 2+imitation 3.0 Audio
10. Left glass side panel
11. Supports 240MM water cooling
–
Product material specifications:
1. Hardware architecture: 0.45SPCC fully baked paint
2. Hardware specifications: 310 * 185 * 410MM
3. Product specifications: 315 * 185 * 420MM (including panel glass and foot pads)


RAMOS 8GB 3200MHz CL22 DDR4

  • Number of Majul: 1 number

  • Suitable for: PC

  • Magol type: U-DIMM

  • Descendant: DDR4

  • Delay: CL22

  • Frequency: 3200 MHz

  • Envelope: 8 GB

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